Ceramic Substrate Electronics

A second fabricates it into a ceramic component e g a capacitor or ceramic substrate while a third integrates it onto an electronic subassembly such as a printed circuit board pcb.

Ceramic substrate electronics.

Ceramic substrates for thick film electronics substrate materials size thickness laser machining laser scribing edge finishing design guides coorstek developed the standards for thick film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits surface mount devices. Substrates made from rubalit alumina ceramics. Our ceramic substrate facilities also produce thick film products for a wide variety of oems in medical telecommunications and defense markets. The role of the substrate in power electronics is to provide the interconnections to form an electric circuit like a printed circuit board and to cool the components compared to materials and techniques used in lower power microelectronics these substrates must carry higher currents and provide a higher voltage isolation up to several thousand volts.

Modern electronics are based on the integrated circuit an assembly of millions of interconnected components such as transistors. With their superb mechanical electrical and thermal properties metalized substrates manufactured by ceramtec are used in power electronics optoelectronics sensor technology in light diodes and as special single layer carriers for microelectronic semiconductors. Ceramtec metalization layer formation. Finally a fourth company inserts the subassembly in the final electronic product e g a television or personal computer the item an end user recognizes.

Ceramic based components are indispensable in products such as smartphones computers televisions automotive electronics and medical devices. Advantages of htcc and ltcc ltcc and htcc technology as a unique solution for high interconnect density and compact networks and high frequency applications. Rubalit 708 s with 96 al 2 o 3. Ceramic pcb are more durable have improved thermal properties and resist better to environmental hazards since electronic modules are experiencing increased integration complexity and more stringent environmental specifications we believe that choosing the right material can make all the difference to meet these.

The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications sputtering. Electronic substrate and package ceramics advanced industrial materials that owing to their insulating qualities are useful in the production of electronic components. This ceramic material is characterized by its extremely high strength and thermal conductivity.